• Product Model HSB26-343408
  • Brand CUI Devices
  • RoHS Yes
  • Description HEAT SINK, BGA, 33.5 X 33.5 X 8
  • Classification Heat Sinks
  • PDF
Inventory:2281

Technical Details

  • Material Aluminum Alloy
  • Length 1.319" (33.50mm)
  • Shape Square, Pin Fins
  • Type Top Mount
  • Width 1.319" (33.50mm)
  • Package Cooled BGA
  • Attachment Method Adhesive
  • Power Dissipation @ Temperature Rise 4.94W @ 75°C
  • Thermal Resistance @ Forced Air Flow 5.30°C/W @ 200 LFM
  • Thermal Resistance @ Natural 15.19°C/W
  • Fin Height 0.315" (8.00mm)
  • Material Finish Black Anodized

Related Products


HEATSINK TO-220 2.5W LOW PROFILE

Inventory: 8612

HEATSINK CPU W/ADHESIVE 1.51"SQ

Inventory: 0

HEAT SINK, BGA, 25 X 25 X 18 MM

Inventory: 2914

HEAT SINK, BGA, 40 X 40 X 10 MM

Inventory: 847

HEAT SINK, BGA, 40 X 40 X 18 MM

Inventory: 1158

HEAT SINK, BGA,25 X 25 X 10 MM

Inventory: 859

HEAT SINK, BGA, 28.5 X 28.5 X 10

Inventory: 1044

HEAT SINK, EXTRUSION, TO-220, 25

Inventory: 14288

CERAMIC HEAT SINK - WAVE TYPE

Inventory: 1400

HEATSINK CPU XCUT

Inventory: 4762

Top