- Product Model HSB16-404018
- Brand CUI Devices
- RoHS Yes
- Description HEAT SINK, BGA, 40 X 40 X 18 MM
- Categories Heat Sinks
-
PDF
- In Stock 2658
Technical Details
- Material Aluminum Alloy
- Length 1.575" (40.00mm)
- Shape Square, Pin Fins
- Type Top Mount
- Width 1.575" (40.00mm)
- Package Cooled BGA
- Attachment Method Adhesive
- Power Dissipation @ Temperature Rise 9.4W @ 75°C
- Thermal Resistance @ Forced Air Flow 2.60°C/W @ 200 LFM
- Thermal Resistance @ Natural 7.96°C/W
- Fin Height 0.709" (18.00mm)
- Material Finish Black Anodized
- ECCN EAR99
- HTSUS 8473.30.5100
- Moisture Sensitivity Level (MSL) Not Applicable
- REACH Status REACH Unaffected
- RoHS Status ROHS3 Compliant
Related Products
HEATSINK BGA W/ADHESIVE TAPE
In Stock: 2905
HEATSINK DC/DC HALF BRICK VERT
In Stock: 6073
HEATSINK DC/DC HALF BRICK VERT
In Stock: 5609
TE MODULE,127 COUPLES,SILICONE
In Stock: 1500
HEAT SINK 40MM X 40MM X 19.5MM
In Stock: 2069
MAXIGRIP FANSINK 40X40X24.5MM
In Stock: 1748
HEAT SINK, BGA, 35 X 35 X 18 MM
In Stock: 2309
HEAT SINK, BGA, 40 X 40 X 25 MM
In Stock: 1689
HEAT SINK, BGA, 33.5 X 33.5 X 8
In Stock: 2281
