• Product Model HSB16-404018
  • Brand CUI Devices
  • RoHS Yes
  • Description HEAT SINK, BGA, 40 X 40 X 18 MM
  • Classification Heat Sinks
  • PDF
Inventory:2658

Technical Details

  • Material Aluminum Alloy
  • Length 1.575" (40.00mm)
  • Shape Square, Pin Fins
  • Type Top Mount
  • Width 1.575" (40.00mm)
  • Package Cooled BGA
  • Attachment Method Adhesive
  • Power Dissipation @ Temperature Rise 9.4W @ 75°C
  • Thermal Resistance @ Forced Air Flow 2.60°C/W @ 200 LFM
  • Thermal Resistance @ Natural 7.96°C/W
  • Fin Height 0.709" (18.00mm)
  • Material Finish Black Anodized

Related Products


HEATSINK BGA W/ADHESIVE TAPE

Inventory: 1405

HEATSINK DC/DC HALF BRICK VERT

Inventory: 4573

HEATSINK DC/DC HALF BRICK VERT

Inventory: 4109

TE MODULE,127 COUPLES,SILICONE

Inventory: 0

HEAT SINK 40MM X 40MM X 19.5MM

Inventory: 569

MAXIGRIP FANSINK 40X40X24.5MM

Inventory: 248

HEAT SINK, BGA, 35 X 35 X 18 MM

Inventory: 809

HEAT SINK, BGA, 40 X 40 X 25 MM

Inventory: 189

HEAT SINK, BGA, 33.5 X 33.5 X 8

Inventory: 781

Top