• Product Model HSB14-353518
  • Brand CUI Devices
  • RoHS Yes
  • Description HEAT SINK, BGA, 35 X 35 X 18 MM
  • Classification Heat Sinks
  • PDF
Inventory:2309

Technical Details

  • Material Aluminum Alloy
  • Length 1.378" (35.00mm)
  • Shape Square, Pin Fins
  • Type Top Mount
  • Width 1.378" (35.00mm)
  • Package Cooled BGA
  • Attachment Method Adhesive
  • Power Dissipation @ Temperature Rise 8.4W @ 75°C
  • Thermal Resistance @ Forced Air Flow 3.60°C/W @ 200 LFM
  • Thermal Resistance @ Natural 8.97°C/W
  • Fin Height 0.709" (18.00mm)
  • Material Finish Black Anodized

Related Products


THERM PAD 35X35MM W/ADH WHT

Inventory: 791

HEATSINK BGA W/ADHESIVE TAPE

Inventory: 1637

HEAT SINK, BGA, 25 X 25 X 18 MM

Inventory: 2914

HEAT SINK, BGA, 40 X 40 X 18 MM

Inventory: 1158

HEAT SINK, BGA, 35 X 35 X 25 MM

Inventory: 406

HEAT SINK, BGA,25 X 25 X 10 MM

Inventory: 859

HEAT SINK, BGA, 33.5 X 33.5 X 8

Inventory: 781

Top