- Product Model HSB15-404010
- Brand CUI Devices
- RoHS Yes
- Description HEAT SINK, BGA, 40 X 40 X 10 MM
- Classification Heat Sinks
-
PDF
Technical Details
- Material Aluminum Alloy
- Length 1.575" (40.00mm)
- Shape Square, Pin Fins
- Type Top Mount
- Width 1.575" (40.00mm)
- Package Cooled BGA
- Attachment Method Adhesive
- Power Dissipation @ Temperature Rise 6.3W @ 75°C
- Thermal Resistance @ Forced Air Flow 3.90°C/W @ 200 LFM
- Thermal Resistance @ Natural 11.84°C/W
- Fin Height 0.394" (10.00mm)
- Material Finish Black Anodized
Related Products
HEATSINK BGA W/ADHESIVE TAPE
Inventory: 638
HEATSINK BGA W/ADHESIVE TAPE
Inventory: 1405
FAN AXIAL 30X8MM 5VDC
Inventory: 0
ADHESIVE - THERMAL CONDUCTIVE EP
Inventory: 115
HEAT SINK, BGA, 14 X 14 X 6 MM
Inventory: 0
HEAT SINK, BGA, 20 X 20 X 9 MM
Inventory: 0
HEAT SINK, BGA, 40 X 40 X 18 MM
Inventory: 1158
HEAT SINK, BGA, 40 X 40 X 25 MM
Inventory: 189
THERM TAPE 43X43MM W/ADH WHT
Inventory: 7
HEATSINK ALUM ANOD
Inventory: 0
