- Product Model HSB07-202009
- Brand CUI Devices
- RoHS Yes
- Description HEAT SINK, BGA, 20 X 20 X 9 MM
- Classification Heat Sinks
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Technical Details
- Material Aluminum Alloy
- Length 0.787" (20.00mm)
- Shape Square, Pin Fins
- Type Top Mount
- Width 0.787" (20.00mm)
- Package Cooled BGA
- Attachment Method Adhesive
- Power Dissipation @ Temperature Rise 3.1W @ 75°C
- Thermal Resistance @ Forced Air Flow 8.60°C/W @ 200 LFM
- Thermal Resistance @ Natural 24.08°C/W
- Fin Height 0.354" (9.00mm)
- Material Finish Black Anodized
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