• Product Model HSB03-121218
  • Brand CUI Devices
  • RoHS Yes
  • Description HEAT SINK, BGA, 12 X 12 X 18 MM
  • Categories Heat Sinks
  • PDF PDF
  • In Stock 1500

Technical Details

  • Material Aluminum Alloy
  • Length 0.472" (12.00mm)
  • Shape Square, Pin Fins
  • Type Top Mount
  • Width 0.472" (12.00mm)
  • Package Cooled BGA
  • Attachment Method Adhesive
  • Power Dissipation @ Temperature Rise 3.1W @ 75°C
  • Thermal Resistance @ Forced Air Flow 9.60°C/W @ 200 LFM
  • Thermal Resistance @ Natural 24.01°C/W
  • Fin Height 0.709" (18.00mm)
  • Material Finish Black Anodized
  • ECCN EAR99
  • HTSUS 8473.30.5100
  • Moisture Sensitivity Level (MSL) Not Applicable
  • REACH Status REACH Unaffected
  • RoHS Status ROHS3 Compliant

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