- Product Model HSB23-232325
- Brand CUI Devices
- RoHS Yes
- Description HEAT SINK, BGA, 23 X 23 X 25 MM
- Categories Heat Sinks
-
PDF
- In Stock 1939
Technical Details
- Material Aluminum Alloy
- Length 0.906" (23.00mm)
- Shape Square, Pin Fins
- Type Top Mount
- Width 0.906" (23.00mm)
- Package Cooled BGA
- Attachment Method Adhesive
- Power Dissipation @ Temperature Rise 6.13W @ 75°C
- Thermal Resistance @ Forced Air Flow 3.80°C/W @ 200 LFM
- Thermal Resistance @ Natural 12.23°C/W
- Fin Height 0.984" (25.00mm)
- Material Finish Black Anodized
- ECCN EAR99
- HTSUS 8473.30.5100
- Moisture Sensitivity Level (MSL) Not Applicable
- REACH Status REACH Unaffected
- RoHS Status ROHS3 Compliant
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