- Product Model HSB01-080808
- Brand CUI Devices
- RoHS Yes
- Description HEAT SINK, BGA, 8.5 X 8.5 X 8 MM
- Categories Heat Sinks
-
PDF
- In Stock 4436
Technical Details
- Material Aluminum Alloy
- Length 0.335" (8.50mm)
- Shape Square, Pin Fins
- Type Top Mount
- Width 0.335" (8.50mm)
- Package Cooled BGA
- Attachment Method Adhesive (Not Included)
- Power Dissipation @ Temperature Rise 1.9W @ 75°C
- Thermal Resistance @ Forced Air Flow 16.00°C/W @ 200 LFM
- Thermal Resistance @ Natural 39.10°C/W
- Fin Height 0.315" (8.00mm)
- Material Finish Black Anodized
- ECCN EAR99
- HTSUS 8473.30.5100
- Moisture Sensitivity Level (MSL) Not Applicable
- REACH Status REACH Unaffected
- RoHS Status ROHS3 Compliant
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