库存:1912

技术细节

  • 锥形 Aluminum Alloy
  • 执行器直径 0.984" (25.00mm)
  • 输出类型 Square, Pin Fins
  • 介电材料 Top Mount
  • B0/50 0.984" (25.00mm)
  • 线缆长度 Assorted (BGA, LGA, CPU, ASIC...)
  • 放电率 Thermal Tape, Adhesive (Not Included)
  • 绑带材料 5.00°C/W
  • 产能(磅) 0.728" (18.50mm)
  • 座高 Black Anodized

相关产品


THERM PAD 609.6X457.2MM GRAY

库存: 0

HEAT SINK 25MM X 25MM X 24.5MM

库存: 197

BGA HEATSINK W/TAPE

库存: 1

HEAT SINK, BGA, 25 X 25 X 18 MM

库存: 2914

HEAT SINK, BGA, 23 X 23 X 25 MM

库存: 439

HEAT SINK THERMAL COMPOUND

库存: 575

HEATSINK CPU FORGED

库存: 1729

HEATSINK CPU FORGED

库存: 1637

HEATSINK CPU FORGED

库存: 1463

HEATSINK CPU FORGED

库存: 1460

Top