技术参数

• Package / Case 6-XFBGA, WLCSP
• Mounting Type Surface Mount
• Operating Temperature 150°C (TJ)
• Technology MOSFET (Metal Oxide)
• FET Type N-Channel
• Current - Continuous Drain (Id) @ 25°C 8.7A (Ta)
• Rds On (Max) @ Id, Vgs 21mOhm @ 3A, 4.5V
• Power Dissipation (Max) 400mW
• Vgs(th) (Max) @ Id 900mV @ 250µA
• Supplier Device Package 6-WLCSP (1.48x0.98)
• Drive Voltage (Max Rds On, Min Rds On) 1.5V, 4.5V
• Vgs (Max) ±8V
• Drain to Source Voltage (Vdss) 20 V
• Gate Charge (Qg) (Max) @ Vgs 6.2 nC @ 4.5 V
• Input Capacitance (Ciss) (Max) @ Vds 1050 pF @ 10 V
• ECCN EAR99
• HTSUS 8541.21.0095
• Moisture Sensitivity Level (MSL) 1 (Unlimited)
• REACH Status REACH Unaffected
• RoHS Status ROHS3 Compliant