- Product Model HSB27-434316
- Brand CUI Devices
- RoHS Yes
- Description HEAT SINK, BGA, 43.1 X 43.1 X 16
- Classification Heat Sinks
-
PDF
Technical Details
- Material Aluminum Alloy
- Length 1.697" (43.10mm)
- Shape Square, Pin Fins
- Type Top Mount
- Width 1.697" (43.10mm)
- Package Cooled BGA
- Attachment Method Adhesive
- Power Dissipation @ Temperature Rise 8.98W @ 75°C
- Thermal Resistance @ Forced Air Flow 2.80°C/W @ 200 LFM
- Thermal Resistance @ Natural 8.35°C/W
- Fin Height 0.650" (16.51mm)
- Material Finish Black Anodized
Related Products
HEAT SINK, BGA, 40 X 40 X 10 MM
Inventory: 847
HEAT SINK, BGA, 40 X 40 X 25 MM
Inventory: 189
HEAT SINK, BGA, 45 X 45 X 15 MM
Inventory: 934
HEAT SINK, BGA, 60 X 60 X 10 MM
Inventory: 0
HEAT SINK, BGA, 60 X 60 X 22 MM,
Inventory: 0
TRANS NPN 80V 0.5A SST3
Inventory: 15640
THERM TAPE 43X43MM W/ADH WHT
Inventory: 7
