- Product Model HSB09-212115
- Brand CUI Devices
- RoHS Yes
- Description HEAT SINK, BGA, 21 X 21 X 15 MM
- Classification Heat Sinks
-
PDF
Technical Details
- Material Aluminum Alloy
- Length 0.827" (21.00mm)
- Shape Square, Pin Fins
- Type Top Mount
- Width 0.827" (21.00mm)
- Package Cooled BGA
- Attachment Method Adhesive
- Power Dissipation @ Temperature Rise 4.3W @ 75°C
- Thermal Resistance @ Forced Air Flow 6.00°C/W @ 200 LFM
- Thermal Resistance @ Natural 17.39°C/W
- Fin Height 0.591" (15.00mm)
- Material Finish Black Anodized
Related Products
HEAT SINK, BGA, 17 X 17 X 11.5 M
Inventory: 807
HEAT SINK, BGA, 20 X 20 X 9 MM
Inventory: 0
HEAT SINK, BGA, 25 X 25 X 18 MM
Inventory: 2914
HEAT SINK, BGA, 23 X 23 X 10 MM
Inventory: 4619
HEAT SINK, BGA, 23 X 23 X 25 MM
Inventory: 439
TERMINAL BLOCK, SCREWLESS, 2.54,
Inventory: 410
THERM PAD 20MMX20MM GRAY
Inventory: 4052
HEATSINK ANOD ALUM CPU
Inventory: 441
HEATSINK CPU XCUT
Inventory: 5253
CPU HEATSINK, CROSS CUT, AL6063,
Inventory: 676
