技术参数

• Material Aluminum
• Diameter 0.625" (15.88mm) ID, 1.330" (33.78mm) OD
• Type Board Level
• Package Cooled Stud Mounted Diode
• Attachment Method Bolt On
• Power Dissipation @ Temperature Rise 4.0W @ 72°C
• Thermal Resistance @ Forced Air Flow 5.20°C/W @ 400 LFM
• Thermal Resistance @ Natural 18.00°C/W
• Fin Height 0.530" (13.46mm)
• Material Finish Black Anodized
• ECCN EAR99
• HTSUS 8473.30.5100
• Moisture Sensitivity Level (MSL) 1 (Unlimited)
• REACH Status REACH Unaffected
• RoHS Status ROHS3 Compliant