• 库存 98

技术参数

  • Material Aluminum
  • Length 0.250" (6.35mm)
  • Shape Rectangular
  • Type Board Level
  • Width 0.500" (12.70mm)
  • Package Cooled Stud Mounted Diode
  • Attachment Method Type 120 Compound
  • Thermal Resistance @ Natural 12.00°C/W
  • Fin Height 0.340" (8.64mm)
  • ECCN EAR99
  • HTSUS 8473.30.5100
  • Moisture Sensitivity Level (MSL) Not Applicable
  • REACH Status REACH Unaffected
  • RoHS Status Not applicable

相关产品


SILICONE GREASE 4 GRAM

库存: 0

HEATSINK 14-16 DIP BLACK .19"

库存: 3098

SMALL HEATSINK

库存: 0

HEAT SINK COMPOUND - HIGH DENSIT

库存: 13

HEAT SINK THERMAL COMPOUND

库存: 575

ALUMINIUM HEAT SINK 7.5X7.5MM

库存: 436

HEATSINK CPU XCUT

库存: 36043

PROFILE HEATSINK, FLAT BACK, AL6

库存: 0

HEATSINK ALUM ANOD

库存: 33166

HEATSINK ALUM ANOD

库存: 7195

Top