• 产品型号 HSB19-272718
  • 品牌 CUI Devices
  • RoHS Yes
  • 描述 HEAT SINK, BGA, 27 X 27 X 18 MM
  • 分类 散热片
  • PDF PDF
  • 库存 20

技术参数

  • Material Aluminum Alloy
  • Length 1.063" (27.00mm)
  • Shape Square, Pin Fins
  • Type Top Mount
  • Width 1.063" (27.00mm)
  • Package Cooled BGA
  • Attachment Method Adhesive
  • Power Dissipation @ Temperature Rise 6.8W @ 75°C
  • Thermal Resistance @ Forced Air Flow 4.50°C/W @ 200 LFM
  • Thermal Resistance @ Natural 11.11°C/W
  • Fin Height 0.709" (18.00mm)
  • Material Finish Black Anodized
  • ECCN EAR99
  • HTSUS 8473.30.5100
  • Moisture Sensitivity Level (MSL) Not Applicable
  • REACH Status REACH Unaffected
  • RoHS Status ROHS3 Compliant

相关产品


HEATSINK BGA W/ADHESIVE TAPE

库存: 2291

THERM PAD 100MMX100MM W/ADH

库存: 0

FAN AXIAL 26.6X20.9MM 5VDC 2510

库存: 704

HEAT SINK, BGA, 25 X 25 X 18 MM

库存: 2914

HEAT SINK, BGA, 23 X 23 X 10 MM

库存: 4619

HEAT SINK, BGA,25 X 25 X 10 MM

库存: 859

Top