• 产品型号 HSB18-232310
  • 品牌 CUI Devices
  • RoHS Yes
  • 描述 HEAT SINK, BGA, 23 X 23 X 10 MM
  • 分类 散热片
  • PDF PDF
  • 库存 4619

技术参数

  • Material Aluminum Alloy
  • Length 0.906" (23.00mm)
  • Shape Square, Pin Fins
  • Type Top Mount
  • Width 0.906" (23.00mm)
  • Package Cooled BGA
  • Attachment Method Adhesive
  • Power Dissipation @ Temperature Rise 3.7W @ 75°C
  • Thermal Resistance @ Forced Air Flow 6.80°C/W @ 200 LFM
  • Thermal Resistance @ Natural 20.41°C/W
  • Fin Height 0.394" (10.00mm)
  • Material Finish Black Anodized
  • ECCN EAR99
  • HTSUS 8473.30.5100
  • Moisture Sensitivity Level (MSL) Not Applicable
  • REACH Status REACH Unaffected
  • RoHS Status ROHS3 Compliant

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