• 产品型号 HSB08-212106
  • 品牌 CUI Devices
  • RoHS Yes
  • 描述 HEAT SINK, BGA, 21 X 21 X 6 MM
  • 分类 散热片
  • PDF PDF
  • 库存 1995

技术参数

  • Material Aluminum Alloy
  • Length 0.827" (21.00mm)
  • Shape Square, Pin Fins
  • Type Top Mount
  • Width 0.827" (21.00mm)
  • Package Cooled BGA
  • Attachment Method Adhesive
  • Power Dissipation @ Temperature Rise 3.0W @ 75°C
  • Thermal Resistance @ Forced Air Flow 9.70°C/W @ 200 LFM
  • Thermal Resistance @ Natural 25.40°C/W
  • Fin Height 0.236" (6.00mm)
  • Material Finish Black Anodized
  • ECCN EAR99
  • HTSUS 8473.30.5100
  • Moisture Sensitivity Level (MSL) Not Applicable
  • REACH Status REACH Unaffected
  • RoHS Status ROHS3 Compliant

相关产品


HEATSINK PIN-FIN W/TAPE

库存: 5689

HEATSINK CPU 21MM SQ W/DBL TAPE

库存: 3636

HEATSINK CPU 25MM SQ W/DBL TAPE

库存: 6903

HEAT SINK, BGA, 17 X 17 X 6 MM

库存: 3383

HEAT SINK, BGA, 20 X 20 X 9 MM

库存: 1500

HEAT SINK, BGA, 23 X 23 X 6 MM

库存: 1500

HEAT SINK, BGA, 23 X 23 X 10 MM

库存: 6119

HEAT SINK, BGA,25 X 25 X 10 MM

库存: 2359

THERMAL TAPE 340X340MM GREY

库存: 1500

Top