- Product Model TC1-200G
- Brand Chip Quik, Inc.
- RoHS Yes
- Description HEAT SINK COMPOUND - HIGH DENSIT
- Categories Adhesives, Epoxies, Greases, Pastes
-
PDF
- In Stock 1513
Technical Details
- Color White
- Size / Dimension 200 gram Jar
- Type Silicone Compound
- Thermal Conductivity 0.67W/m-K
- Storage/Refrigeration Temperature 37°F ~ 77°F (3°C ~ 25°C)
- Shelf Life 60 Months
- ECCN EAR99
- HTSUS 3403.99.0000
- Moisture Sensitivity Level (MSL) Not Applicable
- REACH Status REACH Unaffected
- RoHS Status ROHS3 Compliant
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