- Product Model TC1-20G
- Brand Chip Quik, Inc.
- RoHS Yes
- Description HEAT SINK COMPOUND - HIGH DENSIT
- Categories Adhesives, Epoxies, Greases, Pastes
-
PDF
- In Stock 1500
Technical Details
- Color White
- Size / Dimension 20 gram Syringe
- Shipping Info Shipped from Digi-Key
- Type Silicone Compound
- Thermal Conductivity 0.67W/m-K
- Storage/Refrigeration Temperature 37°F ~ 77°F (3°C ~ 25°C)
- Shelf Life Start Date of Manufacture
- Shelf Life 60 Months
- ECCN EAR99
- HTSUS 3403.99.0000
- Moisture Sensitivity Level (MSL) Not Applicable
- REACH Status REACH Unaffected
- RoHS Status ROHS3 Compliant
Related Products
THERMAL PASTE
In Stock: 1626
HEAT SINK COMPOUND WHT 142G TUBE
In Stock: 2583
SILICONE THERMAL GREASE 30G JAR
In Stock: 1551
THERMAL COMPOUND 10GR, 8.5W
In Stock: 1527
HEAT SINK COMPOUND - HIGH DENSIT
In Stock: 1664
HEAT SINK THERMAL COMPOUND
In Stock: 1678
HEAT SINK THERMAL COMPOUND
In Stock: 1559
HEAT SINK THERMAL COMPOUND - DEE
In Stock: 1517
HEAT SINK THERMAL COMPOUND - DEE
In Stock: 1525
NANO THERMAL GREASE, 5G IN A SYR
In Stock: 2012
