技术参数

• Package / Case 6-XFBGA, WLCSP
• Mounting Type Surface Mount
• Configuration 2 N-Channel (Dual) Common Drain
• Operating Temperature 150°C (TJ)
• Technology MOSFET (Metal Oxide)
• Power - Max 2.5W (Ta)
• Drain to Source Voltage (Vdss) 20V
• Current - Continuous Drain (Id) @ 25°C 23A (Ta)
• Rds On (Max) @ Id, Vgs 4.7mOhm @ 5A, 4.5V
• Gate Charge (Qg) (Max) @ Vgs 75nC @ 4.5V
• FET Feature Logic Level Gate, 2.5V Drive
• Vgs(th) (Max) @ Id 1.3V @ 1mA
• Supplier Device Package 6-WLCSP (1.77x3.05)
• ECCN EAR99
• HTSUS 8541.29.0095
• Moisture Sensitivity Level (MSL) Not Applicable
• REACH Status REACH Unaffected
• RoHS Status ROHS3 Compliant