技术参数

• Material Aluminum Alloy
• Length 2.000" (50.80mm)
• Shape Rectangular, Fins
• Type Board Level, Vertical
• Width 3.000" (76.20mm)
• Package Cooled Stud Mounted Semiconductor Cases
• Attachment Method Press Fit
• Power Dissipation @ Temperature Rise 15.0W @ 37°C
• Thermal Resistance @ Forced Air Flow 1.30°C/W @ 250 LFM
• Fin Height 2.000" (50.80mm)
• Material Finish Black Anodized
• ECCN EAR99
• HTSUS 8473.30.5100
• Moisture Sensitivity Level (MSL) 1 (Unlimited)
• REACH Status REACH Unaffected
• RoHS Status ROHS3 Compliant