• 库存 1757

技术参数

  • Material Aluminum
  • Length 0.906" (23.01mm)
  • Shape Square, Pin Fins
  • Type Top Mount
  • Width 0.906" (23.01mm)
  • Package Cooled BGA
  • Attachment Method Thermal Tape, Adhesive (Included)
  • Power Dissipation @ Temperature Rise 1.0W @ 40°C
  • Thermal Resistance @ Forced Air Flow 11.70°C/W @ 200 LFM
  • Thermal Resistance @ Natural 40.00°C/W
  • Fin Height 0.394" (10.00mm)
  • Material Finish Black Anodized
  • ECCN EAR99
  • HTSUS 8473.30.5100
  • Moisture Sensitivity Level (MSL) Not Applicable
  • REACH Status REACH Unaffected
  • RoHS Status ROHS3 Compliant

相关产品


HEATSINK BGA W/ADHESIVE TAPE

库存: 738

HEATSINK BGA 35X35X10MM W/ADH

库存: 485

HEATSINK BGA W/ADHESIVE TAPE

库存: 1405

HEATSINK PIN-FIN W/TAPE

库存: 4189

HEATSINK CPU 21MM SQ W/DBL TAPE

库存: 2136

HEAT SINK, BGA, 21 X 21 X 6 MM

库存: 495

HEAT SINK BGA/PGA 16.5X16.5X8.9

库存: 3037

FAN AXIAL 40X10.5MM 5VDC WIRE

库存: 444

HEATSINK CPU XCUT

库存: 909

Top