技术参数

• Material Aluminum, Plastic
• Diameter 3.543" (90.00mm) OD
• Shape Round
• Type Board Level
• Package Cooled Intel LGA1156 & LGA1155 Cooler
• Attachment Method Bolt On
• Thermal Resistance @ Natural 0.52°C/W
• Fin Height 1.181" (30.00mm)
• ECCN EAR99
• HTSUS 8414.59.6590
• Moisture Sensitivity Level (MSL) 1 (Unlimited)
• REACH Status REACH Unaffected
• RoHS Status ROHS3 Compliant