技术细节
- 锥形 Composite
- 执行器直径 0.650" (16.51mm)
- 输出类型 Square, Pin Fins
- 介电材料 Top Mount
- B0/50 0.650" (16.51mm)
- 线缆长度 BGA
- 放电率 Thermal Tape, Adhesive (Not Included)
- 频率 - 输出1 2.0W @ 40°C
- 频率 - 输出2 25.00°C/W @ 350 LFM
- 产能（磅） 0.400" (10.16mm)
相关产品
HEAT SINK KIT FOR RASPBERRY PI 4
库存: 28844
THERM PAD 15MMX15MM W/ADH WHT
库存: 515
HEATSINK PIN-FIN W/TAPE
库存: 4189
HEATSINK 128PQFP COMPOSITE
库存: 173
PURE COPPER HEATSINK PACK OF 5 (
库存: 40
HEAT SINK, BGA, 12 X 12 X 18 MM
库存: 0
ALUMINIUM HEAT SINK 16.4X16MM
库存: 124
HEATSINK ANOD ALUM CPU
库存: 441
HEATSINK ALUM ANOD
库存: 33166
CERAMIC HEATSINK WITH CLIP
库存: 0
