技术参数

• Package / Case 4-XFLGA
• Mounting Type Surface Mount
• Configuration 2 N-Channel (Half Bridge)
• Operating Temperature 150°C (TJ)
• Technology MOSFET (Metal Oxide)
• Power - Max 500mW
• Input Capacitance (Ciss) (Max) @ Vds 685pF @ 10V
• Vgs(th) (Max) @ Id 1.2V @ 200µA
• Supplier Device Package 4-Chip LGA (1.59x1.59)
• ECCN EAR99
• HTSUS 8541.21.0095
• Moisture Sensitivity Level (MSL) 1 (Unlimited)