技术参数

• Material Copper Alloy
• Length 0.763" (19.38mm)
• Shape Rectangular, Fins
• Type Board Level
• Width 1.000" (25.40mm)
• Package Cooled TO-263
• Attachment Method SMD Pad
• Thermal Resistance @ Natural 11.00°C/W
• Fin Height 0.450" (11.43mm)
• Material Finish Tin
• ECCN EAR99
• HTSUS 8473.30.5100