技术参数

• Material Copper Alloy
• Length 0.315" (8.00mm)
• Shape Rectangular, Fins
• Type Top Mount
• Width 0.900" (22.86mm)
• Package Cooled TO-252
• Attachment Method SMD Pad
• Thermal Resistance @ Natural 24.00°C/W
• Fin Height 0.400" (10.16mm)
• Material Finish Tin
• ECCN EAR99
• HTSUS 8473.30.5100