技术参数

• Package / Case 16-SSIP Exposed Pad, Formed Leads
• Mounting Type Through Hole
• Type MOSFET
• Configuration H-Bridge
• Current 33 A
• Voltage 650 V
• ECCN EAR99
• HTSUS 8542.39.0001
• Moisture Sensitivity Level (MSL) Not Applicable
• REACH Status REACH Unaffected
• RoHS Status ROHS3 Compliant