• 产品型号 HSS25-B20-P51
  • 品牌 CUI Devices
  • RoHS No
  • 描述 HEAT SINK, STAMPING, TO-218/TO-2
  • 分类 散热片
  • PDF PDF
  • 库存 0

技术参数

  • Material Aluminum Alloy
  • Length 1.000" (25.40mm)
  • Shape Square, Fins
  • Type Board Level
  • Width 1.000" (25.40mm)
  • Package Cooled TO-218, TO-220
  • Attachment Method PC Pin
  • Power Dissipation @ Temperature Rise 5.88W @ 75°C
  • Thermal Resistance @ Forced Air Flow 6.30°C/W @ 200 LFM
  • Thermal Resistance @ Natural 12.75°C/W
  • Fin Height 1.673" (42.50mm)
  • Material Finish Black Anodized
  • ECCN EAR99
  • HTSUS 8473.30.5100
  • Moisture Sensitivity Level (MSL) Not Applicable
  • REACH Status REACH Unaffected
Top