技术参数

• Package / Case Die
• Mounting Type Surface Mount
• Diode Type Single
• Operating Temperature -55°C ~ 125°C
• Capacitance @ Vr, F 0.4pF @ 4V, 1MHz
• Q @ Vr, F 5000 @ 4V, 50MHz
• Capacitance Ratio Condition C0/C30
• Supplier Device Package Chip
• Voltage - Peak Reverse (Max) 30 V
• Capacitance Ratio 4.2
• ECCN EAR99
• HTSUS 8541.10.0040
• REACH Status REACH Unaffected