技术参数

• Material Copper
• Length 0.500" (12.70mm)
• Shape Rectangular, Fins
• Type Top Mount
• Width 1.031" (26.20mm)
• Package Cooled TO-263 (D²Pak)
• Attachment Method SMD Pad
• Power Dissipation @ Temperature Rise 1.3W @ 30°C
• Thermal Resistance @ Forced Air Flow 10.00°C/W @ 200 LFM
• Fin Height 0.390" (9.91mm)
• Material Finish Tin
• ECCN EAR99
• HTSUS 8473.30.5100
• Moisture Sensitivity Level (MSL) Not Applicable