技术参数

• Package / Case Die
• Mounting Type Surface Mount
• Diode Type Single
• Operating Temperature -65°C ~ 175°C
• Capacitance @ Vr, F 5.1pF @ 4V, 1MHz
• Q @ Vr, F 1500 @ 4V, 50MHz
• Capacitance Ratio Condition C2/C20
• Supplier Device Package Chip
• Voltage - Peak Reverse (Max) 22 V
• Capacitance Ratio 11.1
• ECCN EAR99
• HTSUS 8541.10.0060
• Moisture Sensitivity Level (MSL) 1 (Unlimited)