Technical Details

• Package / Case 9-XFBGA, DSBGA
• Mounting Type Surface Mount
• Operating Temperature -55°C ~ 150°C (TJ)
• Technology MOSFET (Metal Oxide)
• FET Type P-Channel
• Current - Continuous Drain (Id) @ 25°C 3.8A (Ta)
• Rds On (Max) @ Id, Vgs 40mOhm @ 2A, 4.5V
• Power Dissipation (Max) 900mW (Ta)
• Vgs(th) (Max) @ Id 1.1V @ 250µA
• Supplier Device Package X2-DSN1515-9 (Type B)
• Drive Voltage (Max Rds On, Min Rds On) 1.8V, 4.5V
• Vgs (Max) -6V
• Drain to Source Voltage (Vdss) 25 V
• Gate Charge (Qg) (Max) @ Vgs 4.7 nC @ 4.5 V
• Input Capacitance (Ciss) (Max) @ Vds 566 pF @ 10 V