- Product Model TC4-10G
- Brand Chip Quik, Inc.
- RoHS Yes
- Description HEAT SINK THERMAL COMPOUND - DEE
- Classification Adhesives, Epoxies, Greases, Pastes
-
PDF
Technical Details
- Color Silver
- Size / Dimension 10 gram Syringe
- Type Thermal Compound, Liquid Metal
- Thermal Conductivity 79.00 W/m-K
- Storage/Refrigeration Temperature 68°F ~ 77°F (20°C ~ 25°C)
- Shelf Life Start Date of Manufacture
- Shelf Life 60 Months
- Usable Temperature Range -40°F ~ 302°F (-40°C ~ 150°C)
Related Products
ADHESIVE - THERMAL CONDUCTIVE EP
Inventory: 115
NON-SILICONE THERMAL PUTTY 7.5 W
Inventory: 4
THERMAL COMPOUND 3.5GR, 8.5W
Inventory: 236
HEAT SINK COMPOUND - GREY ULTRA
Inventory: 24
HEAT SINK THERMAL COMPOUND
Inventory: 178
HEAT SINK THERMAL COMPOUND
Inventory: 575
HEAT SINK THERMAL COMPOUND - DEE
Inventory: 25
HEAT SINK THERMAL COMPOUND - DEE
Inventory: 34
NON-SILICONE THERMAL GREASE 30G
Inventory: 215
NANO THERMAL GREASE, 5G IN A SYR
Inventory: 512
