- Product Model TC3-3.5G
- Brand Chip Quik, Inc.
- RoHS Yes
- Description HEAT SINK THERMAL COMPOUND
- Classification Adhesives, Epoxies, Greases, Pastes
-
PDF
Technical Details
- Color Gray
- Size / Dimension 3.5 gram Syringe
- Type Silicone Compound
- Thermal Conductivity 8.50W/m-K
- Storage/Refrigeration Temperature 37°F ~ 77°F (3°C ~ 25°C)
- Shelf Life Start Date of Manufacture
- Shelf Life 60 Months
- Usable Temperature Range -40°F ~ 302°F (-40°C ~ 150°C)
Related Products
SILICONE FREE HEAT SINK COMP.
Inventory: 156
HEAT SINK GREASE SILICONE FREE
Inventory: 611
THERMAL COMPOUND 3.5GR, 8.5W
Inventory: 236
HEAT SINK COMPOUND - HIGH DENSIT
Inventory: 164
HEAT SINK COMPOUND - GREY ULTRA
Inventory: 24
HEAT SINK THERMAL COMPOUND
Inventory: 178
HEAT SINK THERMAL COMPOUND
Inventory: 575
HEAT SINK THERMAL COMPOUND - DEE
Inventory: 17
NON-SILICONE THERMAL GREASE 30G
Inventory: 215
THERMAL GREASE 30G GREY
Inventory: 773
