• Product Model HSB12-272706
  • Brand CUI Devices
  • RoHS Yes
  • Description HEAT SINK, BGA, 27 X 27 X 6 MM
  • Classification Heat Sinks
  • PDF
Inventory:2755

Technical Details

  • Material Aluminum Alloy
  • Length 1.063" (27.00mm)
  • Shape Square, Pin Fins
  • Type Top Mount
  • Width 1.063" (27.00mm)
  • Package Cooled BGA
  • Attachment Method Adhesive
  • Power Dissipation @ Temperature Rise 3.8W @ 75°C
  • Thermal Resistance @ Forced Air Flow 7.80°C/W @ 200 LFM
  • Thermal Resistance @ Natural 19.59°C/W
  • Fin Height 0.236" (6.00mm)
  • Material Finish Black Anodized

Related Products


HEATSINK BGA W/ADHESIVE TAPE

Inventory: 738

HEATSINK CPU 28MM SQ BLK W/TAPE

Inventory: 1077

HEATSINK 31X31X6MM

Inventory: 79

HEAT SINK, BGA, 17 X 17 X 6 MM

Inventory: 1883

HEAT SINK, BGA, 23 X 23 X 10 MM

Inventory: 4619

FAN AXIAL 25X6.1MM 5VDC WIRE

Inventory: 249

ALUMINIUM HEAT SINK 28X20MM

Inventory: 967

HEATSINK CPU XCUT

Inventory: 909

Top