技术参数

• Package / Case 6-XFBGA, WLCSP
• Mounting Type Surface Mount
• Configuration 2 N-Channel (Dual) Common Drain
• Operating Temperature -55°C ~ 150°C (TJ)
• Technology MOSFET (Metal Oxide)
• Power - Max 556mW (Ta)
• Gate Charge (Qg) (Max) @ Vgs 13nC @ 4.5V
• Vgs(th) (Max) @ Id 900mV @ 250µA
• Supplier Device Package 6-WLCSP (1.48x0.98)
• ECCN EAR99
• HTSUS 8541.21.0095
• Moisture Sensitivity Level (MSL) 1 (Unlimited)
• REACH Status REACH Unaffected
• RoHS Status ROHS3 Compliant