技术参数
- Material Copper
- Length 0.763" (19.38mm)
- Shape Rectangular, Fins
- Type Board Level
- Width 1.000" (25.40mm)
- Package Cooled TO-263 (D²Pak)
- Power Dissipation @ Temperature Rise 3.8W @ 75°C
- Thermal Resistance @ Forced Air Flow 5.50°C/W @ 200 LFM
- Thermal Resistance @ Natural 21.90°C/W
- Fin Height 0.450" (11.43mm)
- Material Finish Tin
- ECCN EAR99
- HTSUS 8473.30.5100
- Moisture Sensitivity Level (MSL) Not Applicable
- REACH Status REACH Unaffected
- RoHS Status ROHS3 Compliant
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