技术参数

• Package / Case PowerPAK® ChipFet Dual
• Mounting Type Surface Mount
• Configuration 2 N-Channel (Dual)
• Operating Temperature -55°C ~ 150°C (TJ)
• Technology MOSFET (Metal Oxide)
• Power - Max 10.4W
• Drain to Source Voltage (Vdss) 30V
• Current - Continuous Drain (Id) @ 25°C 6A (Tc)
• Input Capacitance (Ciss) (Max) @ Vds 765pF @ 15V
• Rds On (Max) @ Id, Vgs 19.2mOhm @ 5A, 10V
• Gate Charge (Qg) (Max) @ Vgs 7.1nC @ 4.5V
• Vgs(th) (Max) @ Id 2.2V @ 250µA
• Supplier Device Package PowerPAK® ChipFet Dual
• ECCN EAR99
• HTSUS 8541.29.0095
• Moisture Sensitivity Level (MSL) 1 (Unlimited)
• RoHS Status ROHS3 Compliant