技术参数

• Material Copper
• Length 0.320" (8.13mm)
• Shape Rectangular, Fins
• Type Top Mount
• Width 0.900" (22.86mm)
• Package Cooled SMD
• Attachment Method SMD Pad
• Power Dissipation @ Temperature Rise 2.0W @ 62°C
• Thermal Resistance @ Forced Air Flow 21.00°C/W @ 200 LFM
• Thermal Resistance @ Natural 31.00°C/W
• Fin Height 0.400" (10.16mm)
• Material Finish Tin
• ECCN EAR99
• HTSUS 8473.30.5100
• Moisture Sensitivity Level (MSL) Not Applicable
• REACH Status REACH Unaffected
• RoHS Status RoHS non-compliant