技术参数
- Material Aluminum, Plastic
- Shape Round
- Type Board Level
- Package Cooled Pentium® III & Pentium® 4
- Attachment Method Clip
- Thermal Resistance @ Forced Air Flow 0.28°C/W
- Fin Height 2.465" (62.60mm)
- ECCN EAR99
- HTSUS 8473.30.5100
- Moisture Sensitivity Level (MSL) Not Applicable
- RoHS Status ROHS3 Compliant


