技术参数

• Features Board Guide, Solder Retention
• Color Black
• Mounting Type Surface Mount
• Wire Gauge 20-26 AWG
• Pitch 0.100" (2.54mm)
• Operating Temperature -40°C ~ 125°C
• Mating Orientation Horizontal with Board
• Positions Per Level 10
• Housing Material Liquid Crystal Polymer (LCP), Glass Filled
• Contact Material - Plating Copper Alloy - Tin Plated
• Wire Termination Screwless - Spring Cage, Tension Clamp
• Current 6 A
• Number of Levels 1
• Voltage 160 V
• ECCN EAR99
• HTSUS 8536.90.4000
• Moisture Sensitivity Level (MSL) 1 (Unlimited)
• REACH Status REACH Unaffected
• RoHS Status ROHS3 Compliant