技术参数

• Package / Case 6-XFBGA, WLCSP
• Mounting Type Surface Mount
• Configuration 2 N-Channel (Dual) Common Drain
• Operating Temperature -55°C ~ 150°C (TJ)
• Technology MOSFET (Metal Oxide)
• Power - Max 500mW
• Drain to Source Voltage (Vdss) 20V
• Current - Continuous Drain (Id) @ 25°C 10A
• Input Capacitance (Ciss) (Max) @ Vds 2055pF @ 10V
• Rds On (Max) @ Id, Vgs 13mOhm @ 1A, 4.5V
• Gate Charge (Qg) (Max) @ Vgs 24nC @ 10V
• FET Feature Logic Level Gate
• Vgs(th) (Max) @ Id 1.2V @ 250µA
• Supplier Device Package 6-WLCSP (1.3x2.3)
• ECCN EAR99
• HTSUS 8541.21.0095
• Moisture Sensitivity Level (MSL) 1 (Unlimited)
• REACH Status REACH Unaffected
• RoHS Status ROHS3 Compliant