技术参数

• Package / Case 3-XFDFN
• Mounting Type Surface Mount
• Operating Temperature 150°C (TJ)
• FET Type N-Channel
• Input Capacitance (Ciss) (Max) @ Vds 4pF @ 10V
• Current Drain (Id) - Max 10 mA
• Supplier Device Package ECSP1006-3
• Drain to Source Voltage (Vdss) 30 V
• Power - Max 100 mW
• Resistance - RDS(On) 200 Ohms
• Voltage - Cutoff (VGS off) @ Id 180 mV @ 1 µA
• Current - Drain (Idss) @ Vds (Vgs=0) 1.2 mA @ 10 V
• ECCN EAR99
• HTSUS 8541.21.0095
• Moisture Sensitivity Level (MSL) 1 (Unlimited)
• REACH Status REACH Unaffected