• 库存 21076

技术参数

  • Material Aluminum
  • Length 1.100" (27.94mm)
  • Shape Square, Pin Fins
  • Type Top Mount
  • Width 1.100" (27.94mm)
  • Package Cooled BGA
  • Attachment Method Thermal Tape, Adhesive (Included)
  • Power Dissipation @ Temperature Rise 2.5W @ 30°C
  • Thermal Resistance @ Forced Air Flow 2.00°C/W @ 500 LFM
  • Fin Height 0.600" (15.24mm)
  • Material Finish Black Anodized
  • ECCN EAR99
  • HTSUS 8473.30.5100
  • Moisture Sensitivity Level (MSL) 1 (Unlimited)
  • REACH Status REACH Unaffected
  • RoHS Status ROHS3 Compliant

相关产品


HEAT SINK KIT FOR RASPBERRY PI 4

库存: 3733

HEATSINK CPU 40.6MM SQ H=.525"

库存: 3129

HEATSINK CPU 28MM SQ BLK W/TAPE

库存: 26534

HEATSINK CPU 28MM SQ BLK W/OTAPE

库存: 1703

HEATSINK FORGED W/ADHESIVE TAPE

库存: 10852

HEAT SINK 17MM X 17MM X 9.5MM

库存: 23

HEAT SINK 19MM X 19MM X 9.5MM

库存: 1727

HEATSINK CPU W/ADHESIVE .91"SQ

库存: 2164

HEATSINK ALUM ANOD

库存: 33166

Top