技术参数

• Material Aluminum, Copper, Plastic
• Diameter 4.094" (104.00mm) OD
• Shape Round
• Type Board Level
• Package Cooled Intel LGA1366 CPU Cooler
• Attachment Method Bolt On
• Thermal Resistance @ Natural 0.25°C/W
• Fin Height 2.480" (63.00mm)
• ECCN EAR99
• HTSUS 8473.30.5100
• Moisture Sensitivity Level (MSL) 1 (Unlimited)
• REACH Status REACH Unaffected
• RoHS Status ROHS3 Compliant