技术参数

• Package / Case 20-PowerSIP Module, Formed Leads
• Mounting Type Through Hole
• Type IGBT
• Configuration 2 Phase
• Voltage - Isolation 1500Vrms
• Current 30 A
• Voltage 600 V
• ECCN EAR99
• HTSUS 8542.39.0001
• Moisture Sensitivity Level (MSL) 1 (Unlimited)
• REACH Status REACH Unaffected