技术参数

• Material Aluminum
• Length 0.650" (16.51mm)
• Shape Square, Fins
• Type Board Level
• Width 0.653" (16.59mm)
• Package Cooled Assorted (BGA, LGA, CPU, ASIC...)
• Attachment Method Thermal Tape, Adhesive (Included)
• Thermal Resistance @ Forced Air Flow 8.00°C/W @ 500 LFM
• Fin Height 0.350" (8.89mm)
• Material Finish Black Anodized
• ECCN EAR99
• HTSUS 8473.30.5100
• Moisture Sensitivity Level (MSL) 1 (Unlimited)
• REACH Status REACH Unaffected
• RoHS Status ROHS3 Compliant