技术参数

• Material Aluminum
• Length 1.063" (27.00mm)
• Shape Square, Pin Fins
• Type Board Level
• Width 1.063" (27.00mm)
• Package Cooled BGA, FPGA
• Attachment Method Solder Anchor
• Power Dissipation @ Temperature Rise 1.5W @ 50°C
• Thermal Resistance @ Forced Air Flow 6.00°C/W @ 500 LFM
• Thermal Resistance @ Natural 30.60°C/W
• Fin Height 0.394" (10.00mm)
• Material Finish Black Anodized
• ECCN EAR99
• HTSUS 8473.30.5100
• Moisture Sensitivity Level (MSL) Not Applicable
• REACH Status REACH Unaffected
• RoHS Status ROHS3 Compliant