• 产品型号 HSB01-080808
  • 品牌 CUI Devices
  • RoHS Yes
  • 描述 HEAT SINK, BGA, 8.5 X 8.5 X 8 MM
  • 分类 散热片
  • PDF PDF
  • 库存 5936

技术参数

  • Material Aluminum Alloy
  • Length 0.335" (8.50mm)
  • Shape Square, Pin Fins
  • Type Top Mount
  • Width 0.335" (8.50mm)
  • Package Cooled BGA
  • Attachment Method Adhesive (Not Included)
  • Power Dissipation @ Temperature Rise 1.9W @ 75°C
  • Thermal Resistance @ Forced Air Flow 16.00°C/W @ 200 LFM
  • Thermal Resistance @ Natural 39.10°C/W
  • Fin Height 0.315" (8.00mm)
  • Material Finish Black Anodized
  • ECCN EAR99
  • HTSUS 8473.30.5100
  • Moisture Sensitivity Level (MSL) Not Applicable
  • REACH Status REACH Unaffected
  • RoHS Status ROHS3 Compliant

相关产品


SILENTSTEPSTICK HEATSINK 9 X 9 X

库存: 2651

HEAT SINK, BGA, 10 X 10 X 7 MM

库存: 4212

HEAT SINK, BGA, 12 X 12 X 18 MM

库存: 1500

HEAT SINK, BGA, 17 X 17 X 6 MM

库存: 3383

HEAT SINK, BGA, 18 X 18 X 10 MM

库存: 3452

THERM TAPE 8X8MM W/ADH WHT

库存: 1885

ALUMINIUM HEAT SINK 7.5X7.5MM

库存: 1936

HEAT SINK COPPER DPAK TO-252

库存: 7164

HEATSINK CPU XCUT

库存: 37543

HEATSINK ALUM ANOD

库存: 34666

Top